TDA3MDDBABFQ1
Part Number:
TDA3MDDBABFQ1
Product Classification:
System On Chip (SoC)
Manufacturer:
Texas Instruments
Description:
LOW POWER SOC W/ FULL-FEATURED P
Packaging:
Tape & Reel (TR)
ROHS Status:
Yes
Currency:
-
PDF:
Documents
Specification
- Part Status Active
- Operating Temperature -40°C ~ 125°C (TJ)
- Primary Attributes -
- RAM Size 512KB
- Peripherals DMA, POR, PWM, WDT
- Flash Size -
- Number of I/O 126
- Package / Case 367-BFBGA, FCBGA
- Supplier Device Package 367-FCBGA (15x15)
- Architecture DSP, MPU
- Core Processor ARM® Cortex®-M4, C66x
- Connectivity CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
- Speed 212.8MHz, 500MHz