K4B4G1646E-BMMA Industrial Grade DDR3L for Obsolete Bill of Materials Support
K4B4G1646E-BMMA Industrial-grade DDR3L, suitable for supporting legacy bill of materials
K4B4G1646E-BMMA is a 4Gb DDR3L SDRAM manufactured by Samsung, specifically designed for systems requiring a 16-bit data bus, DDR3L-1866 performance, and an industrial-grade temperature range. For OEM and EMS customers, this product offers the greatest value in approved legacy platforms, where complete bill-of-materials consistency is critical; Samsung has classified this device as end-of-life, so supply verification and traceability checks are essential.
Quick Answer
When an approved design requires a 4Gb (512MB), 256M × 16 DDR3L, with a maximum per-pin operating speed of 1866Mb/s, in a 96-ball FBGA package, and a operating temperature range of −40°C to +95°C, please select the K4B4G1646E-BMMA. Do not substitute with a DDR3 device of the same capacity without engineering verification.
Conceptual diagram—this is not an actual photo or packaging image of a Samsung product.
Product Overview and Positioning
This device is a 4Gb E-die DDR3L SDRAM, organized as 256M × 16. A 4Gb corresponds to a raw capacity of 512MB per chip, not 4GB. At an operating speed of 1866Mb/s per pin and a 16-bit data width, after accounting for protocol and system overhead, the theoretical peak transfer rate of a single device is approximately 3.73GB/s.
The BMMA suffix is used in Samsung's product ordering tables to indicate the industrial-grade temperature, standard power consumption, and DDR3L-1866 option. This distinction is very important because the related BYMA devices, although also rated at 1866 MT/s, belong to the commercial-grade temperature version; whereas BMK0 represents the industrial-grade temperature version of DDR3L-1600.
Four Major Procurement Advantages
1 Industrial Temperature Range
A working temperature range from −40°C to +95°C can meet the demanding requirements of embedded and industrial environments. When the temperature exceeds 85°C, the datasheet specifies a shorter average refresh cycle; therefore, the memory controller and thermal design must be capable of handling high-temperature operating conditions.
2 DDR3L 1866 Performance
At a 933 MHz clock, this device supports a transmission rate of up to 1866 Mb/s per pin and has a rated timing of 13-13-13. Additionally, it is backward compatible with DDR3L-1600 and DDR3L-1333 operating modes, though compatibility must be verified through complete timing checks based on controller configuration.
3 Dual Voltage Compatibility
This SDRAM supports both the JEDEC-standard 1.35 V DDR3L operating mode and the 1.5 V operating mode. When procuring, ensure consistency with the published bill of materials, as voltage support alone does not guarantee equivalence in pinout, timing, layout, or firmware.
4 Compact x16 Organization
The 256M × 16 organization can provide 512MB of raw capacity in a single 96-ball FBGA package. This is ideal for compact controller boards that have already been designed and validated with a 16-bit memory channel.
Technical Parameters and Procurement Insights
|
Parameter |
Official Specification |
Procurement Implications |
|
Manufacturer |
Samsung |
Verify top markings, labels, and batch traceability. |
|
Memory Type |
4Gb E-die DDR3L SDRAM |
Volatile system memory; data is lost when power is off. |
|
Organizational Structure |
256M × 16; 8 Banks |
Equivalent to a raw capacity of 512MB per device. |
|
Speed Grade |
DDR3L-1866, 13-13-13 |
Up to 1866Mb/s per pin; clock frequency of 933MHz. |
|
Voltage |
Operating voltage of 1.35V or 1.5V |
Confirm VDD, VDDQ, and controller settings. |
|
Temperature |
−40°C to +95°C |
Industrial-grade BM suffix; verify the circuit board's thermal performance. |
|
Package |
96-ball FBGA, x16 |
Confirm the pad layout, ball array diagram, and reflow soldering process. |
|
Product Status |
Discontinued as announced on Samsung's official website |
Adopts a procurement and approval process with lifecycle management. |
The above specifications are for qualification and screening purposes. During formal mass production, please use the controlled Samsung datasheet, approved supplier requirements, and accurate post-purchase suffixes.
Applicable Application Scenarios
Concepts for industrial human-machine interfaces and controllers.
Industrial Controllers and Human-Machine Interfaces
K4B4G1646E-BMMA is suitable for established industrial controllers, operator panels, and gateways, all of which are designed based on the 16-bit DDR3L interface. Please retain the published memory initialization, PCB layout, and thermal constraints.
Network and Communication Equipment
Traditional routers, access terminals, and embedded communication boards can use this device as the processor's working memory. Before approving any alternative solution, be sure to verify signal integrity, timing margins, and boot firmware.
Repair and Long-Life Production
This device can be used to support repair, maintenance, and controlled continuation of production, especially when redesign costs exceed the value of retaining the approved bill of materials. Since this device has been discontinued, demand planning should include contingency measures such as remaining useful life quantities, inspections, and redesigns.
Buyer Pain Points and Actual Countermeasures
|
Pain Points |
Actual Countermeasures |
|
4Gb is mistakenly considered 4GB |
Record the original capacity as 512MB per device. |
|
Provide BYMA or BMK0 suffixes |
Check temperature and speed differences; obtain engineering approval. |
|
The source of EOL inventory is uncertain. |
Require supplier qualifications, traceability, photos, and batch-level documentation. |
|
It is recommended to use DDR3L with the same capacity. |
Compare packaging, ball array, structure, timing, voltage, and initialization. |
|
Long-term storage increases processing risks. |
Confirm the dry packaging condition, MSL control, baking history, and solderability plan. |
Verified lifecycle signals
For DDR3L procurement subject to lifecycle management, introduce the concepts of incoming material inspection and traceability.
Samsung's product page identifies K4B4G1646E-BMMA as EOL. This is a core sourcing fact in the procurement plan: quotations or intermediary lists do not alter the manufacturer's lifecycle status. Before scheduling production, please request dated quotations, available quantities, dates and batch numbers, packaging conditions, proof of traceability, and the proposed scope of inspection.
Actual calculations also help avoid specification errors: 4Gb ÷ 8 = 512MB raw capacity, while 1866Mb/s × 16 ÷ 8 ≈ 3.73GB/s theoretical peak bandwidth. These figures describe a single device and should not be confused with module capacity or actual system performance.
Frequently Asked Questions
Is K4B4G1646E-BMMA a 4GB memory chip?
No. It is a 4Gb device, equivalent to 512MB of raw capacity.
Is BMMA an industrial temperature suffix?
Yes. Samsung lists BMMA as the industrial-temperature, standard-power version, supporting DDR3L-1866 speeds.
Can K4B4G1646E-BYMA replace it?
It cannot be automatically substituted. BYMA is a 1866-speed option for commercial temperatures and requires engineering and environmental evaluation.
Can K4B4G1646E-BMK0 replace it?
It cannot be automatically substituted. BMK0 is an industrial-grade DDR3L-1600 speed option, so timing and controller settings must be re-evaluated.
Does EOL mean there is no stock anywhere?
No. EOL describes the manufacturer's lifecycle status, not the real-time market inventory situation. Any available inventory still needs to be verified for its source and condition.
What should an RFQ include?
Please provide the complete MPN, quantity, target date, destination, acceptable date code, packaging method, traceability and inspection requirements, as well as whether alternative solutions can be proposed.
Request for a project-specific quotation
K4B4G1646E-BMMA is best suited for existing approved designs that require 512MB per chip, ×16 DDR3L interface, industrial-grade temperature range, and operating speed of DDR3L-1866. Please send your required quantity, delivery date, target application, and acceptance criteria to our sales team. Before placing an order, please confirm the specific model number, batch information, packaging condition, traceability, and testing options.
Source of technical data
Samsung Semiconductor K4B4G1646E-BMMA product page.View source code
Samsung K4B4G1646E DDR3L datasheet mirror, used for ordering and timing details.View source code
