THGBMBG7D2KBAIL 16GB eMMC 5 FOR OLD EMBEDDED STORAGE
THGBMBG7D2KBAIL 16GB eMMC 5, for traditional embedded storage
THGBMBG7D2KBAIL is a NAND storage device managed by Toshiba, integrating 16GB of flash memory with an eMMC controller in a compact 153-ball FBGA package. Its e‑MMC 5.0 interface and HS400 capability make it suitable for embedded systems that require solderable storage with low host management overhead. For today's OEM and EMS customers, its primary value lies in providing precise component continuity for existing designs, supported by rigorous lifecycle management and source verification.
Quick Answer
When the released bill of materials specifies 16GB e‑MMC 5.0 storage in a 153-ball FBGA package measuring 11.5 × 13 × 0.8mm, please select THGBMBG7D2KBAIL. Toshiba has announced sequential read performance of up to 270MB/s, with an operating temperature range of −25°C to +85°C; please confirm the current lifecycle and actual batch status before purchasing.
Conceptual diagram—this is not an actual product photo or packaging image from Toshiba or Kioxia.
Product Overview and Positioning
THGBMBG7D2KBAIL integrates NAND flash memory and a controller under the JEDEC e‑MMC 5.0 interface. This controller manages internal NAND operations, enabling the host to use standardized command and data protocols without directly handling raw NAND management. It is a board-level storage component, not a removable card or a full-fledged SSD.
This device was released in 2013, utilizing Toshiba's second-generation 19nm NAND process and offering a capacity of 16GB. Given its early release date, it is more suitable for repair, service inventory, and approved legacy-process production rather than unrestricted new designs. Even though the new 16GB eMMC has the same capacity, it cannot simply be used as a direct replacement.
Four Key Advantages of Approved Legacy-Process Designs
1 Controlled eMMC Architecture
The integrated controller reduces the host's direct management burden on the NAND. However, compatibility still depends on the processor, boot ROM, operating system, eMMC feature set, and an approved initialization sequence.
2 Supports HS400 Performance
Toshiba reports that sequential read performance under HS400 mode can reach up to 270 MB/s. This is manufacturer test data and not a guaranteed application performance metric; actual transfer speeds depend on the host controller, software, workload, and board design.
3 Compact 16GB Storage
The 16GB capacity is integrated into a 153-ball package measuring 11.5 × 13mm with a maximum thickness of 0.8mm. This package is suitable for compact embedded motherboards, but the exact footprint and ball grid layout must be within engineering control.
4 Standardized Interface Mode
The e‑MMC 5.0 interface supports 1-bit, 4-bit, and 8-bit data transfers. When purchasing, ensure you use the approved, exact model, as the interface version alone cannot guarantee identical boot behavior, performance, or power-off response.
Technical Parameters and Procurement Guidelines
|
Parameter |
Published Value |
Procurement Implications |
|
Manufacturer |
Toshiba, now Kioxia |
Please verify the historical brand logo and the exact marking on the top. |
|
Capacity |
16GB |
Manages storage capacity; confirm the actual available capacity visible to the host. |
|
Interface |
JEDEC e‑MMC 5.0 |
Requires a compatible host and qualified firmware. |
|
Performance |
Sequential read speeds can reach up to 270 MB/s |
HS400 is manufacturer test data; actual system performance may vary. |
|
Package |
153-ball FBGA |
Confirm package dimensions, ball grid array layout, and reflow soldering profile. |
|
Dimensions |
Maximum 11.5 × 13 × 0.8 mm |
Verify height and PCB mechanical clearance. |
|
Temperature |
−25°C to +85°C |
Do not infer whether it meets automotive or industrial-grade certifications. |
|
Introduction |
Mass production since November 2013 |
Please treat it as a mature device and verify its lifecycle. |
Use these parameters for identification and price inquiry screening. The final technical release should be based on the manufacturer's controlled documentation and accurate suffixes, rather than market descriptions.
Applicable application scenarios
Embedded human-machine interfaces, display advertising, and gateway applications.
Industrial human-machine interfaces and embedded controllers
Existing control panels and compact controllers can use this device to boot images, operating systems, configuration files, and log records. Please verify write load, thermal environment, recovery procedures, and power-off behavior.
Digital Signage and Self-Service Terminal Systems
Traditional signage players and self-service terminals can use soldered eMMC to store application software and media. Be sure to confirm actual read/write requirements, rather than selecting solely based on nominal capacity or interface version.
Network Gateways and Service Maintenance
When using approved precision storage devices, communication terminals and maintenance programs will benefit because there is no need to modify firmware or boot programs. Long-term planning should cover remaining requirements, testing scope, and scheduling for redesign.
Buyer Pain Points and Practical Countermeasures
|
Pain Points |
Practical Countermeasures |
|
Provide updated 16GB eMMC |
Compare interface modes, package types, ball arrays, timing, boot behavior, and firmware. |
|
The current lifecycle remains unclear. |
Please request relevant certification documents and dated quotations from the manufacturer or authorized distributors. |
|
The status of old inventory is unclear. |
Confirm the date and batch number, the condition of dry packaging, MSL handling, baking history, and solderability plan. |
|
Performance is exaggerated. |
Treat 270 MB/s as HS400 test data, not as a guaranteed system throughput value. |
|
Traceability is incomplete. |
Require supplier qualification certifications, label photos, batch documentation, and risk-based inspections. |
Lifecycle and Quality Control
Concepts of incoming inspection and traceability for mature eMMC procurement.
This device entered mass production at the end of 2013; therefore, before including it in the current production schedule, its lifecycle status must be confirmed. Public component databases may indicate that the part has been discontinued, but purchasers should obtain the latest evidence rather than relying solely on secondary databases as the manufacturer's discontinuation notice.
An appropriate incoming material control plan may include document and label review, visual inspection of appearance, X-ray sampling inspection, checks of moisture barriers and humidity indicators, solderability assessment, and electrical testing specific to the application. The depth of these requirements should be determined based on supplier risk, batch history, quantity, and the criticality of the final use.
Frequently Asked Questions
What is the capacity of THGBMBG7D2KBAIL?
It is a 16GB controlled NAND eMMC device.
Which interface version does it use?
Toshiba has announced that it complies with the JEDEC e‑MMC 5.0 standard.
Is the advertised speed 270 MB/s?
Toshiba reports sequential read performance of up to 270 MB/s in HS400 mode. Actual system performance may vary.
Can any 16GB eMMC replace it?
No. Before approval, please compare package type, ball array, voltage, interface characteristics, timing, boot behavior, firmware, and other relevant parameters.
Has it passed automotive-grade certification?
Do not assume it has automotive-grade certification solely based on its operating temperature range. Please request the certification documents required for your intended application.
What should be included in an RFQ?
Please provide the complete MPN, quantity, delivery date, destination, acceptable date code, packaging, traceability and inspection requirements, as well as whether alternative solutions can be proposed.
Please request a project-specific quotation.
The optimal evaluation of THGBMBG7D2KBAIL applies to an existing approved platform that requires 16GB e‑MMC 5.0 storage in its original 153-ball package. Please send your target quantity, desired date, application area, acceptable date code, and inspection standards to our sales team. Before placing an order, be sure to confirm the specific model, batch information, packaging condition, traceability, and current delivery terms.
Technical Source
Toshiba's global press release announcing THGBMBG7D2KBAIL.View Source
Kioxia's corporate announcement regarding the rebranding of Toshiba Memory.View source
